Thermal paste Arctic MX-7 heat sink compound, thermal interface material for CPUs and GPUs

Arctic MX-7 heat sink compound is a non-conductive thermal paste formulated to improve thermal transfer between processors and cooling solutions. Supplied as a smooth, viscous paste, it is intended for use on CPUs, GPUs and other electronic components that require a thermal interface material to reduce thermal resistance and support consistent heat dissipation under varying operating conditions.

Advantages

MX-7 offers stable thermal conductivity and long-term consistency in a non-electrically conductive formula, reducing the risk of short circuits if excess compound contacts nearby components. The paste’s texture enables even spread and good surface conformity, helping to fill micro-gaps between a heat source and heatsink without excessive application. Its composition supports sustained performance over repeated thermal cycles and helps maintain lower operating temperatures for cooling systems.

Suitable for

Key specifications

How to use

Clean contact surfaces thoroughly before application using an appropriate solvent and lint-free cloth, ensuring no old compound, dust or grease remains. Apply a small, pea-sized amount of MX-7 to the centre of the processor die or integrated heat spreader, then mount the heatsink and secure it according to the manufacturer’s instructions; the mechanical pressure will spread the paste into a thin, even layer. For larger surfaces or non-flat contact areas, spread the paste gently with a suitable applicator to ensure complete coverage, taking care not to apply excessive quantity which can reduce thermal efficiency.

Recommendations

Store the tube in a cool, dry place and avoid contaminating the nozzle. Replace the compound if removed during component servicing and reapply fresh material to ensure optimal thermal contact. Follow the cooling solution and device manufacturer guidelines for mounting torque and reassembly intervals to maintain consistent thermal performance.