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ARCTIC TP-3 Premium Performance Thermal Pad 120 x 20 mm, 1 mm
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R19,377
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Ensure the lowest thermal resistance with our award-winning thermal interfaces. Well known for its outstanding quality, our high-performance MX thermal compound is a regular winner in performance tests. It offers a very low thermal resistance due to its minimum bond line thickness and is easy to apply, even for beginners. Thermal pads in various designs and sizes round out the product range.
High Performance - very soft
Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.
Minimization of thermal resistance
The thinner the pad, the lower the termal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.
Versatile Applications
Heat-conducting, vibration-damping, mouldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.
Safe handling
The ARCTIC TP-3 is electrically insulating, non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.
Bridging gaps
The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridges uneven surface and air gaps without stressing sensitive and protruding components.
Available in different thicknesses and sizes
Our thermal pads are available in a choice of 0.5 mm, 1.0 mm and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.
How to use
Clean mating surfaces thoroughly before applying the MX thermal compound or installing a thermal pad. For paste, apply a small, even amount to the heat source and mount the heatsink to spread the compound into a thin bond line. For thermal pads, cut to the required size if needed and place between the components ensuring full contact. Follow component manufacturer torque and mounting guidelines to avoid uneven pressure.
Recommendations
Choose MX thermal compound when seeking the lowest possible thermal resistance for high-performance cooling. Use thermal pads for easy installation or when gap filling and electrical insulation are required. Replace thermal compound when remounting coolers or if thermal performance degrades over time.
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