Thermal paste SAVIO TG-05 1 g — thermal conductivity 18 W/m·K, grey, density 2.6 g/cm³

SAVIO TG-05 is a grey thermal paste supplied in a 1 g syringe designed to improve heat transfer between processors, GPUs and heatsinks. The compound has a thermal conductivity of 18 W/m·K, a density of 2.6 g/cm³ and an operating temperature range from −40 °C to 230 °C. Formulated for filling microscopic surface irregularities, TG-05 helps reduce thermal resistance and supports stable component temperatures in desktop CPUs, graphics cards and compact electronic assemblies.

Advantages

TG-05 provides high thermal conductivity that accelerates heat flow from a chip to its cooling solution while maintaining a non-conductive electrical profile. The paste has a balanced viscosity so it spreads evenly without running, enabling precise application and consistent contact between the heatsink and the component. Its wide operating temperature range and stable physical properties make it suitable for demanding use, including sustained loads and overclocking scenarios.

Suitable for

Key specifications

How to use

Clean both mating surfaces (CPU/GPU heatspreader and heatsink base) with isopropyl alcohol and a lint-free cloth, removing old paste and debris. Apply a small pea-sized amount of SAVIO TG-05 to the centre of the chip and mount the heatsink evenly, allowing the pressure to spread the paste into a thin layer. Re-tighten mounting hardware to the manufacturer’s torque or spec and power on the system to verify normal temperatures. For reapplication, remove components, clean surfaces thoroughly and apply fresh paste.

Recommendations

Use minimal paste to create a continuous thin interface layer; excessive quantity can increase thermal resistance. Avoid contact with nearby electrical contacts despite the paste being non-conductive. Store the product in a cool, dry place and keep the cap secured after use to prevent drying. For best results, follow component manufacturers’ mounting guidelines and allow thermal cycles after first use to settle the interface.