Thermal Pad Thermal Grizzly Minus Pad 8

Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed for efficient heat transfer between electronic components. The pad combines a very elastic, flexible surface with high thermal conductivity to fill and compensate for small gaps between surfaces. It is available in specific dimensions of 30 mm x 30 mm x 1 mm and is made from a ceramic silicon complex with nano aluminium oxide, providing consistent thermal performance across a wide operating temperature range from -100 °C to 250 °C.

Advantages

The Minus Pad 8 offers a thermal conductivity of 8 W/m·K, high compressibility for optimal contact with uneven surfaces, and electrical insulation to prevent short circuits. The material composition ensures easy processing and reliable, constant heat transfer while remaining RoHS-compliant and ecofriendly.

Suitable for

• Thermal coupling between CPUs, GPUs, and heatsinks
• Filling gaps in power electronics and MOSFET assemblies
• Cooling components in compact or tightly packed electronics

Key specifications

• Thermal conductivity: 8 W/m·K
• Dimensions: 30 mm × 30 mm × 1 mm
• Operating temperature: -100 °C to 250 °C
• Material: ceramic silicon complex with nano aluminium oxide (metal oxide and silicone-based)
• Electrical insulation: yes
• Compliance: RoHS

How to use

Clean both contact surfaces to remove dust and grease before applying the pad. Cut the pad to the required size if necessary, then place it gently between the two surfaces so it fills gaps and makes uniform contact. Apply minimal pressure to seat the pad — the material’s compressibility and adhesion will ensure effective thermal coupling.

Recommendations

Use the Thermal Grizzly Minus Pad 8 for applications requiring reliable thermal transfer and electrical insulation; avoid exposing the pad to sharp edges and solvents that could damage its structure.