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Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs

Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
R292
EK Water Blocks EK-Loop NGP thermal paste in a 5 g syringe is a thermally conductive compound formulated to improve heat transfer between processors and cooling solutions. The paste fills microscopic imperfections on CPU and GPU heat spreaders and cooler contact surfaces, reducing thermal resistance... Read More
Stock 3 Code 312379 Brand EK Water Blocks Model 3831109910214 Warranty 2 Years

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Estimated delivery Thursday, October 1
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EK Water Blocks EK-Loop NGP thermal paste in a 5 g syringe is a thermally conductive compound formulated to improve heat transfer between processors and cooling solutions. The paste fills microscopic imperfections on CPU and GPU heat spreaders and cooler contact surfaces, reducing thermal resistance and helping maintain lower operating temperatures under load. Supplied in a compact syringe, the product is suitable for initial builds, periodic maintenance and aftermarket cooling upgrades.

Advantages

EK-Loop NGP thermal compound offers low thermal resistance and consistent consistency for reliable application. The syringe format allows precise dispensing and controlled coverage with minimal waste. Its formulation is non-curing, which means it remains pliable over time and does not harden, supporting rework and component replacement without residue removal complications.

Suitable for

  • Applying between CPUs and air or liquid coolers
  • Thermal interface on GPU coolers and aftermarket GPU blocks
  • Small heatsinks and other electronic components requiring improved thermal contact

Key specifications

  • Net weight: 5 g
  • Packaging: syringe for controlled dispensing
  • Intended use: CPU and GPU thermal interface
  • Thermal paste type: non-curing, reworkable compound

How to use

Clean both mating surfaces (CPU/GPU heat spreader and cooler base) with isopropyl alcohol or a manufacturer-recommended cleaner and allow them to dry. Apply a small, pea-sized amount of the thermal paste to the center of the processor heat spreader. Mount the cooler according to its instructions and secure it to spread the compound evenly. If disassembling later, remove old compound with a lint-free cloth and alcohol before reapplying fresh paste.

Recommendations

Use a minimal amount sufficient to achieve an even, thin layer after mounting; excessive paste can reduce thermal performance. Store the syringe in a cool, dry place away from direct sunlight and keep caps/seals intact to prevent drying out.

Key Highlights
  • Applying between CPUs and air or liquid coolers
  • Thermal interface on GPU coolers and aftermarket GPU blocks
  • Small heatsinks and other electronic components requiring improved thermal contact
  • Net weight: 5 g
  • Packaging: syringe for controlled dispensing
  • Intended use: CPU and GPU thermal interface
  • Thermal paste type: non-curing, reworkable compound
Price history over the last 6 months
Thermal paste ek water blocks EK-Loop NGP 5 g — thermal compound for CPUs and GPUs
Current
R292
Lowest
R280
Highest
R292
Change 24H
+R10   +3%
Week
+R12   +4%
Month
+R12   +4%

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