Thermal pad Thermal Grizzly Minus Pad Extreme, 100×100×0.5 mm, density 3.38 g/cm³, blue/pink

Thermal Grizzly Minus Pad Extreme is a high-performance thermal pad designed to provide effective heat transfer between electronic components and heatsinks. The sheet measures 100×100×0.5 mm and has a density of 3.38 g/cm³. Its silicone-based, modelling-clay-like consistency enables precise surface shaping and excellent gap filling while remaining electrically insulating. Supplied as a single piece in a polybag, the pad is available in blue and pink and is intended for one-time application to ensure stable thermal contact and maximum compression where components have small height differences.

Advantages

The Minus Pad Extreme offers enhanced thermal conductivity compared with previous generations, improving heat flow for demanding cooling tasks. Its flexible, malleable surface compensates for micro‑unevenness between component and heatsink, reducing thermal resistance. The silicone composition provides electrical insulation, and the uniform 0.5 mm thickness supports repeatable, accurate placement for CPUs, GPUs, memory ICs and power modules where a precise gap-filler is required.

Suitable for

• Thermal coupling between CPUs/GPUs and heatsinks where a thin, consistent pad is needed
• Cooling memory modules and memory ICs with tight tolerances
• Power components and voltage regulators requiring reliable heat transfer and electrical insulation
• Applications where component surface unevenness must be compensated without liquid thermal interface materials

Key specifications

• Sheet dimensions: 100 × 100 × 0.5 mm
• Material base: silicone-based, modelling-clay-like consistency
• Density: 3.38 g/cm³
• Thermal conductivity: significantly improved over previous minus pad versions (approx. 260% increase over Minus Pad 8 as specified by the manufacturer)
• Colors: blue or pink
• Electrical behavior: electrically insulating
• Packaging: single sheet supplied in a protective polybag

How to use

Clean the surfaces of the component and heatsink thoroughly to remove dust, old thermal material and oils. Cut the Minus Pad Extreme sheet to the required shape and size using clean scissors or a sharp blade. Remove protective liners if present and position the pad on the component, then assemble the heatsink and apply normal mounting pressure to achieve compression and conforming contact. Because of its modelling-clay-like consistency and one-time-use recommendation, avoid repositioning the pad repeatedly; for best results use a correctly sized cut piece and apply in a single placement.

Recommendations

Use the 0.5 mm thickness when component heights and tolerances require a thin, uniform interface. For components with larger gaps, choose a thicker Minus Pad Extreme size. Store unused pads in a clean, dry place and avoid contamination with dust or oils prior to application. Single-use application is recommended due to the material’s compressible, mouldable nature.