Thermal pad Thermal Grizzly Minus Pad 8 8 W/m·K 120x20x3 mm

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad with a thermal conductivity of 8 W/m·K. Made from a ceramic-silicone complex with nano aluminum oxide (aluminum oxide), the pad provides effective and consistent heat transfer. Its elastic and flexible surface adapts to small component height differences, and the pad measures 120×20×3 mm. The product is RoHS-compliant and supplied as a single piece, weighing approximately 0.023 kg.

Advantages

The Minus Pad 8 combines high thermal conductivity with a soft, highly adaptable surface that compensates for small gaps between components. Its composition based on ceramic silicone and nano aluminum oxide ensures stable thermal performance across a wide operating temperature range (-100 to 250 °C). The pad is easy to handle and attaches with minimal pressure, and its pink colour helps quick visual identification.

Suitable for

• Improving heat transfer between chips, power components and heatsinks
• Filling small gaps in electronic assemblies and modules
• Thermal management in compact devices where uneven surfaces occur

Key specifications

• Thermal conductivity: 8 W/m·K
• Dimensions: 120 × 20 × 3 mm
• Material: ceramic-silicone complex with nano aluminum oxide (Al2O3)
• Operating temperature: -100 to 250 °C
• Weight: 0.023 kg
• Colour: Pink
• Package quantity: 1 piece

How to use

Clean and dry both mating surfaces before applying the pad. Cut the pad to the required size if necessary, position it so it covers the contact area, and press gently to conform to the components. Ensure there is full contact without trapping air pockets. Reassemble the device and verify proper mechanical fit and thermal contact.

Recommendations

Use the pad for applications where a compliant thermal interface is needed to bridge small gaps; avoid use where electrical conductivity is a concern. Store the pad in a dry environment and handle with clean hands or gloves to maintain surface cleanliness.