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Thermal pad Thermal Grizzly Minus Pad 8

Thermal pad Thermal Grizzly Minus Pad 8
Thermal pad Thermal Grizzly Minus Pad 8
Thermal pad Thermal Grizzly Minus Pad 8
Thermal pad Thermal Grizzly Minus Pad 8
Thermal pad Thermal Grizzly Minus Pad 8
Thermal pad Thermal Grizzly Minus Pad 8
R223
The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed to provide efficient heat transfer between electronic components and heatsinks. Made from a ceramic silicon-based compound with nano aluminium oxide and metal oxide additives, the pad combines high thermal conductivity with e... Read More
Stock 50 Code 300374 Brand THERMAL GRIZZLY Model TG-MP8-120-20-20-1R Warranty 2 Years

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Estimated delivery Friday, October 2
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The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed to provide efficient heat transfer between electronic components and heatsinks. Made from a ceramic silicon-based compound with nano aluminium oxide and metal oxide additives, the pad combines high thermal conductivity with electrical insulation and high compressibility. It is supplied in a compact rectangular format suitable for a range of electronics where gap compensation and reliable thermal coupling are required.

Advantages

The minus pad offers a thermal conductivity of 8 W/m·K while remaining highly compressible to fill small gaps between parts. Its flexible, elastic surface enables easy application with minimal pressure and ensures stable contact over time. The material is electrically insulating and RoHS-compliant, providing safe and environmentally compatible operation across a wide temperature range.

Suitable for

  • Thermal coupling between chips, modules and heatsinks in consumer and industrial electronics
  • Filling small air gaps in tight assemblies or uneven surfaces
  • Applications requiring electrical insulation combined with good heat transfer

Key specifications

  • Thermal conductivity: 8 W/m·K
  • Dimensions (approx.): 120 mm × 20 mm × 2 mm
  • Material base: ceramic silicon complex with nano aluminium oxide and metal oxide additives
  • Electrical behaviour: insulating
  • Operating temperature range: -100 °C to 250 °C
  • Compliance: RoHS

How to use

Cut the Minus Pad 8 to the required shape and size using a sharp blade or scissors. Clean and dry both contact surfaces before application to remove dust, grease or residues. Place the pad between the component and the heatsink, then apply light pressure so the pad compresses and conforms to surface irregularities. Reassemble the device and verify that mechanical mounting provides uniform contact without excessive compression beyond the pad’s specified thickness.

Recommendations

Store the thermal pad flat and protected from dust and direct sunlight. Avoid stretching the material. For best thermal performance, ensure surfaces are clean and choose a pad thickness that allows slight compression when the assembly is tightened.
Key Highlights
  • Thermal coupling between chips, modules and heatsinks in consumer and industrial electronics
  • Filling small air gaps in tight assemblies or uneven surfaces
  • Applications requiring electrical insulation combined with good heat transfer
  • Thermal conductivity: 8 W/m·K
  • Dimensions (approx.): 120 mm × 20 mm × 2 mm
  • Material base: ceramic silicon complex with nano aluminium oxide and metal oxide additives
  • Electrical behaviour: insulating
  • Operating temperature range: -100 °C to 250 °C
  • Compliance: RoHS
Specifications
Compliance certificates
RoHS
Constitutive ingredients
Metal oxide, Silicone
Depth
20 mm
Height
2 mm
Operating temperature (T-T)
-100 - 250
Thermal conductivity
8 W/m·K
Type
Thermal pad
Width
120 mm

Leaflet

Open Leaflet
Price history over the last 6 months
Thermal pad Thermal Grizzly Minus Pad 8
Current
R223
Lowest
R179
Highest
R223
Change 24H
+R10   +4%
Week
+R12   +5%
Month
+R10   +5%

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