Thermal pad Gelid Solutions TP-GP04-R-C Density 3.2 g/cm³ Width 120 mm Depth 20 mm Height 1.5 mm

The Gelid Solutions TP-GP04-R-C thermal pad (GP-Ultimate 120×20) is designed for efficient heat transfer between electronic components and heatsinks. With a density of 3.2 g/cm³ and dimensions of 120 mm × 20 mm × 1.5 mm, the pad delivers high thermal conductivity for cooling applications on PCBs with height differences and uneven surfaces. It is non-electrically conductive, non-corrosive, non-curing and non-toxic, and supports a wide operating temperature range from -60°C to 220°C.

Advantages

The thermal pad provides a consistent thermal interface layer that conforms to irregular component surfaces, improving contact between heatsinks and components such as DRAM, VRM, MOSFETs and other SMD parts. Its enhanced multilayer matrix and material composition offer an ultimate thermal conductivity of 15 W/mK, enabling effective heat transfer. The pad is easy to apply, does not cure over time, and maintains its properties across a wide temperature range.

Suitable for

Key specifications

How to use

Clean the contact surfaces on the PCB and heatsink to remove dust, grease and old thermal material. Cut the thermal pad to the required shape and size if necessary, remove protective liners, and place the pad directly onto the component or heatsink so it fully covers the contact area. Apply gentle, even pressure to ensure the pad conforms to irregularities and forms a uniform thermal interface. Reassemble the device and verify mechanical clearance and contact before powering on.

Recommendations

Use the pad on components with moderate to high surface irregularities or height differences where a conformable, non-curing thermal interface is required. Ensure correct thickness and footprint for reliable contact, and avoid stretching the pad during installation. For long-term reliability, check mechanical fixation and airflow in the system to maintain effective cooling.