Thermal pad Thermal Grizzly Minus Pad 8

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed for efficient heat transfer between electronic components. With a composition based on a ceramic silicon complex and nano aluminium oxide, the pad offers high thermal conductivity while remaining elastic and flexible to compensate for small gaps. It is supplied in a compact size of 20 mm × 120 mm and a thickness of 1 mm, and is available in red and brown colours. The material is RoHS-compliant and environmentally friendly.

Advantages

The Minus Pad 8 provides reliable heat conduction across uneven surfaces thanks to its very elastic surface. Its ceramic-silicon and nano aluminium oxide formulation maintains consistent thermal transfer performance, and its flexible structure allows easy placement with minimal pressure. The pad is offered in practical dimensions for a range of electronics applications and meets RoHS environmental standards.

Suitable for

• Thermal coupling of CPUs, GPUs and small power ICs
• Filling small gaps between heat sinks and components
• Cooling solutions in compact electronic devices
• Prototyping and repair of consumer electronics and embedded systems

Key specifications

• Brand: thermal grizzly
• Model: Minus Pad 8 (TG-MP8-120-20-10-2R)
• Dimensions: 20 mm × 120 mm
• Thickness: 1 mm
• Colors: Red, Brown
• Composition: Ceramic silicon complex with nano aluminium oxide
• Compliance: RoHS

How to use

Cut the thermal pad to the required shape and size for the target component. Clean the surfaces to be connected, remove any protective film from the pad, then place it onto the component and apply gentle pressure to ensure full contact. Install the heat sink or mating surface on top and secure as required. The pad adheres with minimal pressure, so avoid excessive force that could squeeze out material or displace it.

Recommendations

Store the pad in a dry, dust-free environment away from direct sunlight. For best thermal performance, choose the correct pad thickness for the gap to avoid compression beyond intended limits. Do not use where liquid thermal interface materials are required; select a pad size slightly larger than the component area to ensure complete coverage.