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Thermal pad DeLOCK 18469 3.2 W/m·K Grey 20x120x1.5 mm

Thermal pad DeLOCK 18469 3.2 W/m·K Grey 20x120x1.5 mm
Thermal pad DeLOCK 18469 3.2 W/m·K Grey 20x120x1.5 mm
R150
The DeLOCK 18469 thermal pad is a grey, silicone-based thermal interface material designed to improve heat dissipation for electronic components such as M.2 modules. With a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 1.5 mm, the pad helps reduce operating temperatures and can cont... Read More
Stock 84 Code 1741805 Brand DELOCK Model 18469 Warranty 2 Years

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The DeLOCK 18469 thermal pad is a grey, silicone-based thermal interface material designed to improve heat dissipation for electronic components such as M.2 modules. With a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 1.5 mm, the pad helps reduce operating temperatures and can contribute to more stable performance and extended component lifespan. The pad is supplied in a polybag and manufactured in China/Taiwan.

Advantages

This thermal pad offers a thermal conductivity of 3.2 W/m·K for efficient heat transfer and comes in a slim 1.5 mm thickness suitable for compact assemblies. It features low oil bleeding, which minimises contamination of electronic contacts and preserves the pad’s thermal and mechanical properties over time to maintain even and stable heat dissipation.

Suitable for

  • Thermal management of M.2 SSD modules
  • Heat dissipation between chips and heatsinks in compact devices
  • Replacing or upgrading existing thermal pads in laptops, mini-PCs and embedded systems
  • Applications requiring a grey silicone thermal pad with low oil bleeding

Key specifications

  • Brand: DELOCK
  • Model / MPN: 18469
  • Thermal conductivity: 3.2 W/m·K
  • Dimensions (W x D x H): 20 x 120 x 1.5 mm
  • Colour: Grey
  • Packaging: Polybag
  • Origin: China / Taiwan
  • EAN: 4043619184699

How to use

Clean the contact surfaces thoroughly to remove dust, grease or old thermal material. Cut the DeLOCK thermal pad to the required size if necessary, peel off the protective liner and place the pad between the heat-generating component (for example an M.2 SSD) and the heatsink or metal cover. Apply gentle, even pressure to ensure full contact and avoid air gaps. Reassemble the device following the manufacturer’s instructions.

Recommendations

For optimal results, use the pad where a 1.5 mm thickness provides adequate contact pressure. Avoid stretching the pad during installation and keep it away from open flames or temperatures beyond the component manufacturer’s specified limits.
Key Highlights
  • Thermal management of M.2 SSD modules
  • Heat dissipation between chips and heatsinks in compact devices
  • Replacing or upgrading existing thermal pads in laptops, mini-PCs and embedded systems
  • Applications requiring a grey silicone thermal pad with low oil bleeding
  • Brand: DELOCK
  • Model / MPN: 18469
  • Thermal conductivity: 3.2 W/m·K
  • Dimensions (W x D x H): 20 x 120 x 1.5 mm
  • Colour: Grey
  • Packaging: Polybag
  • Origin: China / Taiwan
  • EAN: 4043619184699
Specifications
Country of origin
China, Taiwan
Depth
120 mm
Height
1.5 mm
Operating temperature (T-T)
-60 - 180
Package type
Polybag
Product colour
Grey
Quantity per pack
1 pc(s)
Thermal conductivity
3.2 W/m·K
Type
Thermal pad
Width
20 mm

Leaflet

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Price history over the last 6 months
Thermal pad DeLOCK 18469 3.2 W/m·K Grey 20x120x1.5 mm
Current
R150
Lowest
R136
Highest
R150
Change 24H
+R9   +7%
Week
+R11   +8%
Month
+R10   +7%

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