Thermal pad Thermal Grizzly TG-MPE-120-20-15 Density 3.38 g/cm³ Pink 20x120x1.5 mm

The Thermal Grizzly TG-MPE-120-20-15 is a silicone-based thermal pad with a modelling-clay-like consistency that enables precise surface shaping and maximum compression for improved contact. It is electrically insulating and supplied in a pink 20 x 120 x 1.5 mm format with a density of 3.38 g/cm³, suitable for thermal management of components such as voltage regulators and memory ICs. The product is intended for single-use due to its soft consistency.

Advantages

The pad’s modelling-clay texture allows for optimal surface conformity and maximum possible compression, improving contact quality. Thermal conductivity is increased by about 260% compared with the minus pad 8, providing better heat transfer for demanding cooling tasks. The material is electrically insulating and available in a compact, easy-to-cut sheet size.

Suitable for

• Voltage regulators and power ICs
• Memory ICs and modules
• Tight gaps where high compression and surface conformity are required
• Custom heatsink-to-component interfaces in electronics

Key specifications

• Brand: Thermal Grizzly
• Model / MPN: TG-MPE-120-20-15 (TG-MPE-120-20-15-R)
• Dimensions: 20 x 120 x 1.5 mm
• Density: 3.38 g/cm³
• Operating temperature range: -100 to 200 °C
• Colour: Pink
• Electrical property: Electrically insulating
• Recommended use: Single-use (one-time application)
• EAN: 4260711990472

How to use

Cut the thermal pad to the required size and shape for the target component. Remove any protective liners, place the pad onto the cooler or component surface, and apply even pressure to achieve maximum compression and conformity. Ensure mating surfaces are clean and free from dust or grease before application. Because of the soft, modelling-clay consistency, the pad is recommended for single-use installations; replace it if removed or significantly deformed.

Recommendations

Use this pad where high surface conformity and improved thermal conductivity are required — for example, on voltage regulators and memory ICs. Avoid reusing the pad after removal and keep it protected from contaminants prior to installation.