PC Case Akasa MaxWell Pro Mini-ITX Small Form Factor Black

The Akasa MaxWell Pro Mini-ITX Small Form Factor Black is a fanless, thin Mini-ITX PC case designed for quiet compact systems. Constructed from brushed aluminium, the chassis combines passive cooling with a compact footprint (245 mm width x 215.5 mm depth x 68.5 mm height) and supports Mini-ITX motherboards and up to two 2.5" drives. The case is compatible with Intel LGA1700 CPUs with a recommended Thermal Design Point up to 35W and provides VESA mounting options for space-saving installations.

Advantages

The full-aluminium, fanless design provides silent operation while using the case body as a heatsink for heat dissipation. Its slim profile and VESA mount compatibility make it suitable for mounting behind monitors or on walls to free desk space. The brushed finish offers a durable, professional appearance, and the two internal 2.5" bays allow for flexible storage configurations using HDD or SSD media.

Suitable for

• Compact home or office PCs where silence is important
• Thin clients and digital signage or VESA-mounted mini-PC installations
• Low-power Mini-ITX builds using Intel LGA1700 processors up to 35W TDP
• Storage-focused small systems using one or two 2.5" drives

Key specifications

• Form factor: Small Form Factor (SFF) compatible with Mini-ITX motherboards
• Material: Brushed aluminium chassis for passive heat dissipation
• Drive bays: Two 2.5" drive bays (HDD/SSD)
• Cooling: Fanless passive cooling using the case as a heatsink
• CPU compatibility: Supports Intel LGA1700 processors up to 35W TDP
• Dimensions: 245 mm (W) x 215.5 mm (D) x 68.5 mm (H)
• Color: Black
• I/O highlights: Two USB 3.2 Type-A ports (as part of design)
• Mounting: VESA mount support for monitor or wall installation
• Additional: Single serial port support

How to use

Install a Mini-ITX motherboard and low-power CPU compatible with LGA1700 following the motherboard and CPU manufacturer instructions. Mount up to two 2.5" drives in the provided bays and connect power and data cables. Position the case in an area with adequate airflow around the chassis surfaces to allow passive cooling to work effectively. If required, attach VESA mounts to place the system behind a monitor or on a wall. For wireless connectivity, an optional external antenna and pigtail can be fitted using the board's Wi‑Fi connector.

Recommendations

To maintain optimal passive cooling, avoid enclosing the case in tight, non-ventilated compartments and prefer locations with natural airflow. Use processors with TDP at or below 35W and choose SSDs for lower heat and vibration. If wireless connectivity is needed, consider the compatible external antenna and pigtail accessories for improved reception.