PC Case Akasa MaxWell Pro Mini-ITX Small Form Factor Black

The Akasa MaxWell Pro Mini-ITX Small Form Factor Black is a fanless PC case engineered for compact, silent systems using UCFF / Mini-ITX style boards such as Intel NUC 13 Pro (Arena Canyon). Constructed from aluminium with a copper thermal core, the case supports one 2.5" drive, provides two front USB 2.0 ports and is sized at 95 mm (W) x 260 mm (D) x 113.5 mm (H). Its passive thermal module with heatpipes and bi-symmetrical extruded fins is designed to transfer CPU heat to the chassis exterior, enabling up to 40 W thermal point compatibility for supported NUC boards and allowing silent operation for home, office or digital signage environments.

Advantages

The MaxWell Pro uses a copper/aluminium thermal solution and extruded fins to maximise passive heat dissipation while keeping the external footprint small. Its fanless design eliminates mechanical noise and, combined with support for M.2 SSD thermal management, maintains storage performance under sustained load. The removable top cover and rear panel simplify installation and maintenance, and the durable aluminium body gives a contemporary appearance suited to home and business spaces.

Suitable for

• Silent home PC and HTPC systems
• Office workstations where low noise is required
• Digital signage and point-of-sale deployments
• Compact NUC-based systems with up to 40 W TDP
• Small form factor media players and encoding appliances

Key specifications

• Form factor: Small Form Factor (SFF) compatible with UCFF motherboards
• Dimensions (W×D×H): 95 mm × 260 mm × 113.5 mm
• Drive support: 1 × 2.5" drive bay and M.2 slot with SSD thermal kit
• Material: Aluminium chassis with internal copper thermal module and heatpipes
• Cooling: Passive fanless thermal module with two heatpipes and bi-symmetrical extruded fins
• Front I/O: 2 × USB 2.0 ports
• Colour: Black
• Supported CPU thermal point: up to 40 W for compatible NUC boards

How to use

Install a compatible UCFF / Intel NUC 13 Pro board following the removable top cover and rear panel access procedure, secure the board to the internal mounting points and attach the fixed thermal module so heatpipes make correct contact with the CPU. Fit an M.2 SSD and apply the included thermal kit to transfer residual heat to the case exterior; install a 2.5" drive if required. Route any cables to the rear I/O openings and connect displays and power according to the NUC board instructions. Ensure the housing is positioned with adequate clearance for passive airflow over the extruded fins.

Recommendations

Place the case in a location with free airflow around the sides and top fins, avoid enclosing it in sealed compartments, and use solid-state storage where possible to maintain silent operation and maximum reliability. When deploying in continuous or high-load applications such as digital signage, verify the supported board TDP does not exceed 40 W and periodically check for dust accumulation on the exterior fins.