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Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g

Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
R265
The Zalman ZM-STC9 thermal compound provides high thermal conductivity of 9.1 W/m·K in a 4 g syringe, ensuring efficient heat transfer between CPUs or other computer chips and their coolers. The grey, non-electrically conductive paste helps reduce operating temperatures and supports stable performan... Read More
Stock 40 Code 1194305 Brand ZALMAN Model ZM-STC9 Warranty 2 Years

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Estimated delivery Tuesday, September 29
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The Zalman ZM-STC9 thermal compound provides high thermal conductivity of 9.1 W/m·K in a 4 g syringe, ensuring efficient heat transfer between CPUs or other computer chips and their coolers. The grey, non-electrically conductive paste helps reduce operating temperatures and supports stable performance in high-performance systems. Scale markings on the syringe enable accurate visual measurement of the remaining paste, and the rubber cap prevents hardening during storage and reuse.

Advantages

High thermal conductivity improves heat transfer from the chip to the cooler while the non-electrically conductive formulation reduces risk of short circuits. The syringe form factor with scale markings ensures precise application and dosing, and the included rubber cap helps maintain paste usability over time. The compact 4 g volume is suitable for multiple small applications or single CPU installations.

Suitable for

  • Applying thermal paste between CPUs and air or liquid coolers
  • Thermal interface for GPUs, chipsets and VRM components
  • System builds and maintenance where accurate dosing is required

Key specifications

  • Thermal conductivity: 9.1 W/m·K
  • Weight/volume: 4 g (0.004 kg)
  • Colour: Grey
  • Form: Syringe with scale markings and rubber cap
  • Electrical conductivity: non-conductive

How to use

Clean the CPU and cooler contact surfaces from old thermal paste and dust using isopropyl alcohol and a lint-free cloth. Apply a small pea-sized amount of Zalman ZM-STC9 to the centre of the CPU die, then mount the cooler and tighten according to the manufacturer’s instructions to spread the compound evenly. For larger dies, use a thin line or cross pattern as appropriate. After use, replace the rubber cap to prevent drying of the paste.

Recommendations

Store the syringe in a cool, dry place away from direct sunlight. Do not apply excessive amounts — a thin, even layer provides optimal thermal transfer. Keep out of reach of children and avoid contact with skin and eyes; if contact occurs, rinse thoroughly with water.
Key Highlights
  • Excellent Thermal Conductivity (9.1 W/m·k)
  • Micro-Filler Density (2.7 g/cm³)
  • Measuring Graduations for Convenience
  • Capacity 4g
  • RoHS Eco-Friendly Certified
  • 9.1 W/m·K
  • 2.7 g/cm³
  • Grey
  • 1 pc(s)
Specifications
Compliance certificates
RoHS
Density
2.7 g/cm³
Depth
21.2 mm
Height
15 mm
Master (outer) case gross weight
4.4 kg
Master (outer) case height
215 mm
Master (outer) case length
330 mm
Master (outer) case width
355 mm
Package depth
93 mm
Package height
20 mm
Package type
Blister
Package weight
28 g
Package width
168 mm
Product colour
Grey
Products per master (outer) case
120 pc(s)
Quantity per pack
1 pc(s)
Thermal conductivity
9.1 W/m·K
Viscosity note
250 Pa.s
Volume
4 ml
Weight
4 g
Width
117 mm

Leaflet

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Price history over the last 6 months
Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g
Current
R265
Lowest
R245
Highest
R267
Change 24H
+R20   +8%
Week
+R16   +6%
Month
+R15   +6%

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