Zalman ZM-STC8 heat sink compound 8.3 W/m·K 1.5 g

Zalman ZM-STC8 thermal paste is a grey silicone-based compound formulated with aluminum oxide and zinc oxide to provide efficient heat transfer between heat-generating components and heatsinks. With a rated thermal conductivity of 8.3 W/m·K and an operating temperature range from -40 °C to 200 °C, this paste is designed to improve thermal coupling and help cooling systems reach lower component temperatures. The compact package and low mass make it suitable for precise application on CPUs, GPUs and other electronics where a thin, even interface layer is required.

Advantages

The composition combining aluminum oxide, zinc oxide and silicone delivers stable thermal performance and consistent viscosity for straightforward application. High thermal conductivity supports efficient heat dissipation, while the wide operating temperature range maintains material properties across typical PC and electronics thermal cycles. Its grey color helps with visual placement during application, and the small physical size supports targeted use without excess waste.

Suitable for

• Thermal interface between CPUs and heatsinks in desktop and small form-factor systems
• GPU cooling assemblies and graphics card heatsinks
• Cooling contacts for chipsets, VRMs and other heat-generating components on motherboards
• Repair or upgrade work where controlled, thin application of thermal compound is needed

Key specifications

• Thermal conductivity: 8.3 W/m·K
• Operating temperature range: -40 °C to 200 °C
• Product colour: Grey
• Physical dimensions (approx.): 66 mm × 19 mm × 12 mm; package size 40 mm × 110 mm
• Net weight: 0.0015 kg

How to use

Clean both contact surfaces thoroughly to remove old paste, dust and oils using isopropyl alcohol or a suitable cleaner. Apply a small, pea-sized amount of Zalman ZM-STC8 to the centre of the CPU or chip surface, then mount the heatsink and press evenly to spread the compound into a thin uniform layer. For GPUs or large dies, use a thin line or several small dots to achieve full coverage without overflow. Avoid applying excessive amounts; a thin layer ensures optimal thermal transfer and prevents spillage onto the motherboard.

Recommendations

Use in well-ventilated areas and avoid contact with power while installing cooling components. Replace thermal paste during major maintenance, after removing a heatsink, or if thermal performance degrades. Store the paste at room temperature away from direct sunlight and extreme heat to preserve consistency.