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Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g

Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
R170
Zalman ZM-STC7 thermal compound is a grey silicone-based paste formulated with zinc oxide to provide efficient heat transfer between heat-generating components and cooling solutions. Supplied in a 4 g tube, this compound has a thermal conductivity of 7.2 W/m·K and a density of 2.6 g/cm³, offering im... Read More
Stock 44 Code 1194303 Brand ZALMAN Model ZM-STC7 Warranty 2 Years

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Zalman ZM-STC7 thermal compound is a grey silicone-based paste formulated with zinc oxide to provide efficient heat transfer between heat-generating components and cooling solutions. Supplied in a 4 g tube, this compound has a thermal conductivity of 7.2 W/m·K and a density of 2.6 g/cm³, offering improved thermal contact for CPUs, GPUs and other electronic chips. The compact packaging measures 117.4 mm x 21.2 mm x 15 mm and is presented in a polybag with a hanging hole for convenient storage and retail display.

Advantages

The compound’s relatively high thermal conductivity supports better dissipation of heat from processors to heatsinks or water block surfaces, helping to maintain lower operating temperatures under load. Its silicone carrier ensures stable application and moderate viscosity for even spreading, while zinc oxide enhances thermal transfer properties. The 4 g quantity is suitable for multiple applications or for several re-applications during maintenance.

Suitable for

  • Applying a thermal interface between CPUs and heatsinks
  • Thermal coupling for discrete GPUs and laptop cooling modules
  • Re-application during system maintenance or after cleaning cooling assemblies
  • Small electronics requiring improved thermal contact between components and heat spreaders

Key specifications

  • Thermal conductivity: 7.2 W/m·K
  • Density: 2.6 g/cm³
  • Net weight: 4 g
  • Colour: Grey
  • Packaging dimensions: 117.4 mm × 21.2 mm × 15 mm

How to use

Clean both surfaces to be joined—processor lid and heatsink base—with isopropyl alcohol and allow them to dry. Apply a small, pea-sized amount of the Zalman ZM-STC7 thermal compound to the centre of the processor die or heat spreader. Mount the heatsink or cooler straight down with even pressure to spread the compound; avoid lifting and re-seating to prevent air pockets. After installation, run a thermal stress test and check temperatures to confirm proper contact. Re-apply when replacing or reseating the cooler, or if thermal paste shows signs of drying.

Recommendations

Store the product in a cool, dry place away from direct sunlight. Use protective gloves if desired and avoid contact with skin or eyes. Keep out of reach of children. For best thermal results, use an appropriate amount; excessive compound can reduce effectiveness by creating thicker layers that impede heat flow.
Key Highlights
  • Applying a thermal interface between CPUs and heatsinks
  • Thermal coupling for discrete GPUs and laptop cooling modules
  • Re-application during system maintenance or after cleaning cooling assemblies
  • Small electronics requiring improved thermal contact between components and heat spreaders
  • Thermal conductivity: 7.2 W/m·K
  • Density: 2.6 g/cm³
  • Net weight: 4 g
  • Colour: Grey
  • Packaging dimensions: 117.4 mm × 21.2 mm × 15 mm
Specifications
Compliance certificates
RoHS
Constitutive ingredients
Zinc oxide, Silicone
Density
2.6 g/cm³
Depth
21.2 mm
Height
15 mm
Package type
Polybag with hanging hole
Product colour
Grey
Quantity per pack
1 pc(s)
Thermal conductivity
7.2 W/m·K
Viscosity note
220 Pa.s
Weight
4 g
Width
117.4 mm

Leaflet

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Price history over the last 6 months
Zalman ZM-STC7 heat sink compound 7.2 W/m·K 4 g
Current
R170
Lowest
R158
Highest
R170
Change 24H
+R11   +7%
Week
+R12   +8%
Month
+R12   +8%

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