Thermal paste Thermal Grizzly Hydronaut

Thermal Grizzly Hydronaut is a silicone-free thermal paste designed for medium- to large-scale cooling solutions such as water cooling loops. With a thermal conductivity of 11.8 W/m·K and a density of 2.6 g/cm³, the 1 g syringe delivers efficient heat transfer between components without electrical conductivity or curing, making it suitable for demanding builds and overclocking applications.

Advantages

Hydronaut provides excellent thermal conductivity while remaining silicone-free and non-conductive electrically. The compound does not cure over time and is lightweight and flexible, which facilitates even and reliable application. It is ROHS-compliant and optimized for systems with larger cooling surfaces, offering a favorable price-to-performance ratio.

Suitable for

• Water cooling systems and custom loops
• Overclocked CPUs and GPUs in high-performance builds
• Heat spreaders and large cold plates

Key specifications

• Thermal conductivity: 11.8 W/m·K
• Weight: 1 g (0.001 kg)
• Density: 2.6 g/cm³
• Operating temperature: -200 °C to 350 °C
• Silicone-free, non-electrically conductive, no curing
• Brand: Thermal Grizzly, MPN: TG-H-001-RS, EAN: 0753677507586

How to use

Clean both contact surfaces thoroughly, removing old paste, dust and debris. Apply a small, pea-sized amount of Hydronaut to the center of the CPU or heat source and mount the cooler or water block according to the manufacturer’s instructions. Tighten mounting hardware evenly to spread the compound; for large cold plates, use an even thin layer if recommended. No curing time is required before operation.

Recommendations

Use Hydronaut on medium- to large-scale cooling solutions for best results. Avoid contact with exposed circuitry despite its non-conductive properties, and follow the cooler or water block manufacturer’s mounting torque and procedures.