Thermal paste SAVIO TG-01 2G — thermal conductivity 4.7 W/m·K, 2 ml, grey/black

SAVIO TG-01 2G is a thermal paste supplied in a 2 ml syringe, formulated to improve heat transfer between CPUs, GPUs and other heat-generating components and their coolers. With a thermal conductivity of 4.7 W/m·K and a grey/black appearance, this non-metallic, carbon-filled compound fills microscopic surface irregularities to reduce thermal resistance and support stable operating temperatures during normal load and light overclocking scenarios. The compact 2 ml volume and syringe dispensing make it suitable for maintenance, repair and assembly tasks where precise application and minimal waste are required.

Advantages

The carbon microparticles in SAVIO TG-01 bridge surface imperfections to ensure efficient heat dissipation while the non-metallic formulation keeps the compound electrically non-conductive, reducing the risk of short circuits and corrosion of contact surfaces. The paste has a balanced viscosity for smooth spreading, allowing controlled application from the syringe and further shaping with the included spatula. Packaged to limit drying after closing, the 2 ml syringe provides multiple uses for desktop PC servicing and component swaps.

Suitable for

Key specifications

How to use

Clean both the component and heatsink contact surfaces with isopropyl alcohol and a lint-free cloth to remove old compound and contaminants. Apply a small pea-sized or line amount of SAVIO TG-01 2G to the centre of the processor die area, then mount the cooler and secure it following the manufacturer's mounting pattern so the paste spreads evenly. For graphics cards or irregular surfaces, apply an amount appropriate to the contact area and use the included spatula to achieve a thin, uniform layer before reassembling the cooling assembly.

Recommendations

Use in a well-ventilated area and avoid contact with skin and eyes. Store the syringe capped in a cool, dry place to prevent drying. For best thermal performance, replace thermal paste when temperatures rise noticeably under comparable loads or during major component servicing; do not exceed typical mounting torque specified by cooler manufacturers to avoid damage to components.