Thermal pad Thermal Grizzly Minus Pad 8

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed to provide reliable heat transfer between electronic components. Manufactured from a ceramic-silicone complex and nano aluminium oxide (metal oxide and silicone), this flexible pad compensates for small gaps and surface unevenness to maintain consistent thermal contact. It measures 120 mm × 20 mm × 1.5 mm and offers a thermal conductivity of 8 W/m·K with an operating temperature range from -100 °C to 250 °C.

Advantages

The pad delivers high thermal conductivity and high compressibility while remaining electrically insulating. Its elastic and flexible surface conforms to component shapes, enabling optimal contact with minimal pressure. The material composition ensures a constant and efficient heat transfer, and the product is RoHS-compliant and ecofriendly.

Suitable for

• Thermal coupling between CPUs and heatsinks
• Thermal interface for GPUs and memory modules
• Heat transfer for power stages, MOSFETs and other electronic components
• Filling small gaps and irregular surfaces in cooling assemblies

Key specifications

• Brand: thermal grizzly
• Model: Minus Pad 8 (TG-MP8-120-20-15-1R)
• Dimensions: 120 mm × 20 mm × 1.5 mm
• Thermal conductivity: 8 W/m·K
• Operating temperature: -100 °C to 250 °C
• Material: ceramic-silicone complex with nano aluminium oxide (metal oxide and silicone)
• Electrical insulation: yes
• Compliance: RoHS

How to use

Clean the surfaces to be joined, removing dust, grease and residues. Cut the Minus Pad 8 to the required size if necessary, then place it so that it covers the contact area completely. Apply gentle pressure to ensure the pad conforms to both surfaces; only light touching is required for optimal attachment. Reassemble the cooling parts and verify uniform contact. No curing time is needed.

Recommendations

Use the Thermal Grizzly Minus Pad 8 where a compressible, electrically insulating thermal interface is needed. Avoid stretching the pad during installation and ensure that mating surfaces are free of contaminants to maintain maximum thermal performance.