GENESIS Silicon 900 heat sink compound Thermal paste 12.8 W/m·K 2 g

Optimal density and good thermal conductivity properties are not enough. In the kit you will find a moistened cloth and spatula for easy application.

Meet GENESIS Silicon 900 - a high-performance thermal conductive paste that will help you win the unequal battle against temperatures. Optimal density and good thermal conductivity properties are not enough. In the kit you will find a moistened cloth and spatula for easy application.

EFFECTIVE FIGHT AGAINST TEMPERATURES
Low component temperatures? From today you can achieve them with GENESIS Silicon 900 - an easy-to-apply thermal conductive paste distinguished by high thermal conductivity (12.8 w/-K). You do not need to heat it up, you will gain optimal thermal conductivity values from the first seconds after application. What's more, GENESIS paste is distinguished by its safe formula, which means no conductivity and resistance to corrosion.

SIMPLE APPLICATION
Applying GENESIS Silicon 900 is easy not only because of its optimal formula (2.8 g/cm3). This is also due to the included spatula and a moistened cloth, which will allow you to get rid of residual dirt. This makes the application manageable even for the least experienced users.

UNIVERSAL APPLICATION
GENESIS Silicon 900 is great for desktop computers, laptops and consoles. It will keep your performance high and temperatures low during both work and long gaming sessions.

GENESIS Silicon 900. Type: Thermal paste, Thermal conductivity: 12.8 W/m·K, Density: 2.8 g/cm³. Weight: 2 g. Quantity per pack: 1 pc(s)