PC Akasa Pascal MC Small Form Factor SFF Black

The Akasa Pascal MC Small Form Factor SFF Black is a compact PC case engineered for space-constrained environments where silent operation and reliable passive cooling are priorities. With external dimensions of 150 mm (W) x 214 mm (D) x 54 mm (H), this low-profile chassis provides a sleek black aluminium housing that doubles as a passive heatsink for fanless CPU configurations. The design supports efficient thermal transfer, straightforward assembly and integration into multimedia, signage, automotive and other embedded applications.

Advantages

The aluminium fanless CPU cooling design eliminates moving parts near the processor, reducing noise and maintenance while providing steady heat dissipation. Its small form factor and shallow depth make it suitable for mounting in confined spaces or behind displays. The black finish and minimal external detailing enable discreet installation in consumer, industrial and commercial environments. The chassis is built to accommodate a range of compact hardware while maintaining airflow paths and thermal contact for passive cooling.

Suitable for

• Navigation systems and in-vehicle PCs
• Digital signage and multimedia players
• Home theatre and compact desktop builds
• Industrial automation and control equipment
• Medical devices requiring low-noise operation

Key specifications

• External dimensions: 150 mm (W) x 214 mm (D) x 54 mm (H)
• Material: aluminium chassis with passive cooling surfaces
• Cooling: fanless, aluminium heat-dissipating design for CPU
• Form factor: Small Form Factor (SFF) / low-profile case
• Finish: black anodised or painted exterior

How to use

Install compatible compact motherboard and components according to the chassis mounting points and internal layout. Ensure the CPU makes proper contact with the passive cooling surface or heat-spreader interface provided by the aluminium chassis. Route cables to avoid obstructing thermal paths and secure storage devices and power modules in their designated positions. Place the assembled system in a location with adequate ambient ventilation to allow heat to dissipate from the case exterior.

Recommendations

For optimal passive cooling performance, use low- to mid-power processors and confirm thermal interface material is correctly applied between the CPU and chassis. Avoid enclosing the case in completely sealed compartments; allow at least a few centimetres of clearance around the chassis for natural convective airflow. Regularly check component temperatures under load, especially in automotive or outdoor installations where ambient temperatures may be elevated.