Heatsink set ALLNET NanoPi Neo / Neo2 — bulk pack of 50, passive cooling aluminum

Bulk pack of 50 ALLNET heatsink sets designed for FriendlyELEC NanoPi Neo and NanoPi Neo2 single-board computers. Each passive cooling set is made from aluminum and includes multiple small heatsink elements tailored to sit on processor and power-chip locations without the need for tools. The heatsinks improve thermal dissipation, helping to maintain stable operation under sustained CPU or peripheral load in compact installations and mass deployments.

Advantages

The aluminum construction provides a good balance of thermal conductivity and lightweight design suitable for constrained enclosures. Passive operation requires no additional power or moving parts, eliminating fan noise and reducing maintenance. The bulk pack of 50 units supports large-scale projects or industrial rollouts, offering consistent, pre-sized thermal pads and adhesive backing for quick installation. Compatibility with NanoPi Neo and NanoPi Neo2 single-board computers ensures the heatsinks fit common chip layouts used in these SBC models.

Suitable for

• Small SBC prototypes and hobbyist projects using NanoPi Neo / Neo2
• Industrial control panels and embedded systems with space constraints
• Educational labs and training kits requiring multiple identical parts
• Mass deployments and OEM assemblies where repeatable thermal management is needed

Key specifications

• Quantity: 50 heatsink sets in a bulk pack
• Material: aluminum heatsink elements for passive cooling
• Cooling type: passive (no fan)
• Compatibility: designed for FriendlyELEC NanoPi Neo and NanoPi Neo2 chip layouts
• Mounting: adhesive-backed thermal pads for tool-free placement
• Form factor: low-profile heatsinks suitable for compact enclosures

How to use

Before applying a heatsink, power down the single-board computer and disconnect any power sources. Clean the chip surfaces with isopropyl alcohol to remove dust and oils, then allow them to dry completely. Peel the protective film from the adhesive thermal pads and carefully align each heatsink element with the corresponding chip or component on the NanoPi Neo / Neo2 board. Press gently to ensure full contact and secure adhesion. After installation, allow a short settling time before powering up and verify normal operation and temperatures under expected workloads.

Recommendations

For best results, use these passive heatsinks in enclosures with at least minimal airflow to assist heat dispersion. Avoid stacking boards too close together and ensure adhesive surfaces are clean and correctly positioned. If your application consistently runs near temperature limits, monitor operating temperatures and consider complementary cooling measures such as improved enclosure ventilation or active cooling in addition to the heatsinks.