Heatsink/Radiator Inter-Tech IP-3 Copper Silver 165x100x12mm

The Inter-Tech IP-3 is a passive copper and silver heatsink/radiator for AMD® and Intel® processors with a maximum TDP of 70 W. With dimensions of 165 x 100 x 12 mm, a copper thermal pad and three nickel-plated copper heat pipes, the IP-3 transfers CPU waste heat directly to the case and built-in cooling fins, enabling fanless operation in compatible IP-40 and IP-60 enclosures.

Advantages

The IP-3 provides silent, maintenance-free cooling by using a copper thermal pad and three nickel-plated copper heat pipes to move heat from the CPU to the heatsink fins and chassis. Its passive design eliminates the need for active fans, reducing noise and moving parts. The heat pipes are flexible and can be bent to adapt to motherboard and case layouts. Compact dimensions and a lightweight construction simplify integration into small enclosures.

Suitable for

• Fanless or low-noise PC builds in IP-40 and IP-60 cases
• Systems using processors up to 70 W TDP
• Home theatre PCs, silent workstations, and embedded systems
• Motherboards with supported sockets (AMD and Intel variants listed in specifications)

Key specifications

• Product: Heatsink / Radiator Inter-Tech IP-3
• Dimensions: 165 x 100 x 12 mm
• Material / finish: Copper thermal pad, nickel-plated copper heat pipes, silver-coloured fins
• TDP rating: up to 70 W
• Supported sockets: Socket FM2, FM1, AM4, AM3+, AM3, AM2+, AM2; LGA 1700, LGA 1200 (H5), LGA 1156 (H), LGA 1155 (H2), LGA 1150 (H3), LGA 1151 (H4)
• Fan diameter: 0 mm (passive)
• Weight: 0.155 kg
• Colour: Copper / Silver

How to use

Mount the IP-3 on a compatible motherboard following the case and motherboard manufacturer’s mounting guidelines. Ensure the CPU surface is clean and apply thermal interface material if required by your installation; the heatsink uses a copper thermal pad for direct contact with the CPU. Position the heatsink so heat pipes and fins have direct thermal contact with the chassis or the case’s internal cooling surfaces to enable passive heat dissipation. Adjust the flexible heat pipes as needed to fit around components without stressing the motherboard or other parts.

Recommendations

Use the IP-3 in well-ventilated enclosures (IP-40 or IP-60) and with CPUs that do not exceed 70 W TDP. Verify mechanical compatibility with your case and motherboard layout before installation. For systems operating near the 70 W limit, monitor CPU temperatures under load and consider additional case ventilation if necessary.