Akasa Thermal Compound & Thermal Adhesive Tape Bundle (AK-ATC01-220GR + AK-ATN01-BK)

This bundle from Akasa combines two essential thermal interface materials for efficient heat management in electronic devices. The set includes the Akasa AK-ATC01-220GR thermal compound (2.2g, grey) and the Akasa AK-ATN01-BK thermal adhesive tape (100x100x0.5mm, black). Ideal for CPU, GPU, chipsets, heatsinks, LEDs, and other components.

Advantages

Provides both a non-curing thermal paste for direct contact and a double-sided adhesive tape for mounting heatsinks or components. The thermal compound offers high thermal conductivity (3.8 W/mK) and is non-electrically conductive, ensuring safe application. The tape delivers reliable adhesion (1.2 kg/inch) and thermal conductivity (1.5 W/mK), with a wide temperature range (-20°C to 120°C).

Suitable for

• CPU and GPU cooling
• Chipset and heatsink attachment
• LED and electronic component thermal management
• DIY electronics and repair projects

Key specifications

• Thermal compound type: Non-curing paste
• Thermal compound net weight: 2.2g
• Thermal compound colour: Grey
• Thermal compound thermal conductivity: 3.8 W/mK
• Thermal compound viscosity: 73 cP
• Thermal adhesive tape type: Double-sided thermal conductive
• Thermal adhesive tape colour: Black
• Thermal adhesive tape dimensions: 100 x 100 x 0.5 mm
• Thermal adhesive tape thermal conductivity: 1.5 W/mK
• Thermal adhesive tape adhesion strength: 1.2 kg/inch
• Thermal adhesive tape temperature resistance: -20°C to 120°C
• Electrical conductivity (compound): Non-electrical conductive
• RoHS compliant: Yes

Recommendations

For optimal thermal performance, ensure surfaces are clean and free of old thermal material before application. The tape is ideal for permanent mounting, while the compound is suitable for removable applications.