Thermal Grizzly Minus Pad 8 - 30 × 30 × 1.5 mm

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed for efficient heat transfer in electronic components. With a thermal conductivity of 8 W/mK, it provides excellent cooling for CPUs, GPUs, chipsets, VRMs, and memory ICs. This silicone-based pad is electrically non-conductive, ensuring safe use around sensitive circuits. Its non-adhesive, reusable nature allows for easy installation and repositioning.

Advantages

High thermal conductivity of 8 W/mK ensures effective heat dissipation. The pad is electrically non-conductive, eliminating the risk of short circuits. It is reusable and non-adhesive, making it easy to handle and reposition. With a wide operating temperature range from -100 °C to +250 °C, it suits various environments. The UL 94 V-0 flammability rating ensures safety.

Suitable for

• CPUs and GPUs
• Chipsets and VRMs
• Memory ICs and other electronic components

Key specifications

• Thermal Conductivity: 8 W/mK
• Dimensions: 30 × 30 × 1.5 mm
• Colour: Grey
• Material: Silicone-based with ceramic particles
• Hardness: 70 Shore OO
• Density: 3.7 g/cm³
• Dielectric Strength: 12 kV/mm
• Volume Resistivity: 1 × 10^12 Ω-cm
• Operating Temperature: -100 °C to +250 °C
• Flammability Rating: UL 94 V-0
• Quantity per Pack: 1 pad

Recommendations

For optimal thermal performance, ensure the surfaces are clean and free of debris before application. The pad can be cut to size if needed. Suitable for use in computers, servers, and other electronic devices requiring efficient heat management.