Supermicro MCP-350-30204-0N Passive Heatsink for 1U Server, LGA3647, Copper Base, Aluminum Fins

The Supermicro MCP-350-30204-0N is a high-performance passive heatsink designed for 1U rackmount servers. Engineered for Intel Xeon Scalable processors (Skylake-SP and Cascade Lake-SP) with LGA3647 socket, it supports TDP up to 205W with optimal system airflow. The heatsink features an aluminum fin array with a copper base for efficient heat dissipation, and includes pre-applied thermal interface material for easy installation.

Advantages

Passive cooling design ensures silent operation and high reliability, ideal for dense server environments. The copper base enhances thermal conductivity, while the aluminum fins maximize surface area for convection cooling. Pre-applied thermal paste simplifies mounting, and the screw-in mechanism provides secure attachment.

Suitable for

• Supermicro 1U server chassis
• Intel Xeon Scalable processors (Skylake-SP, Cascade Lake-SP)
• Enterprise data centers and high-performance computing

Key specifications

• Heatsink Type: Passive
• Form Factor: 1U Rackmount
• CPU Socket Compatibility: Intel LGA3647 (Socket P)
• Supported CPU Series: Intel Xeon Scalable Processors
• Max TDP Support: Up to 205W (with optimal system airflow)
• Heatsink Material: Aluminum Fins, Copper Base
• Mounting Type: Screw-in
• Thermal Interface Material: Pre-applied
• Application: Server / Workstation
• Cooling Method: Convection (System Airflow Dependent)
• RoHS Compliance: Yes
• Product Series: Supermicro MCP-350 Series

Recommendations

Ensure proper system airflow in your chassis to achieve maximum cooling performance. Compatible with Supermicro X11 series motherboards and 1U chassis. For optimal results, pair with high-static-pressure fans in the server enclosure.