Server processor INTEL Xeon 6349P LGA 1700 6-core 3.6 GHz (boost 5.7 GHz) DDR5 dual-channel Tray

Intel Xeon 6349P is a server-class processor in a Tray package with an LGA 1700 socket. It has 6 cores with a base frequency of 3.6 GHz and can boost up to 5.7 GHz. The processor supports DDR5 dual-channel memory up to 128 GB and modern PCIe Gen5 I/O configurations, making it suitable for enterprise and data-centre workloads that require balanced multi-threaded performance and up-to-date connectivity.

Advantages

The Xeon 6349P provides high per-core boost frequency for responsive single-threaded tasks while offering multiple cores for parallel processing. Support for DDR5 memory and PCIe Gen5 improves memory bandwidth and I/O throughput. As a server-grade CPU, it is designed for continuous operation and compatibility with enterprise motherboard platforms using the LGA 1700 socket.

Suitable for

• Small to medium enterprise servers
• Virtualisation hosts and containerised workloads
• Compute nodes in data centres and rack servers
• Workloads requiring balanced single-thread and multi-thread performance

Key specifications

• Processor family: Intel Xeon
• Model: 6349P
• Socket: LGA 1700
• Cores: 6 (64-bit)
• Base frequency: 3.6 GHz
• Maximum boost frequency: 5.7 GHz
• Supported memory: DDR5, dual-channel, up to 128 GB
• Package type: Tray (processor only)
• PCIe support: PCIe Gen5 configurations (e.g., 2x8+1x4 or 1x16+1x4)

How to use

Install the Intel Xeon 6349P into a compatible LGA 1700 server motherboard following the motherboard and chassis manufacturer instructions. Apply appropriate server-grade cooling and ensure the platform firmware supports the processor. Populate DDR5 memory modules in the correct channels to enable dual-channel operation and configure BIOS/UEFI settings according to workload needs. Use compatible power delivery and follow ESD precautions when handling the CPU.

Recommendations

For optimal reliability in 24/7 server environments, use certified server motherboards and ECC-capable DDR5 modules if supported by the platform, keep firmware up to date, and monitor thermal and power conditions under expected load.