RUKO LOS-HM-28.0mm Halogen-Free No-Clean Soldering Flux Paste 20g

Soldering flux paste with halogen-free, no-clean chemistry for reliable solder joints in electronics assembly and rework. The paste is supplied in a 28 mm diameter tin can containing 20 g net weight, offering low residue and non-corrosive properties after soldering.

Advantages

Halogen-free formulation reduces environmental impact and corrosion risk. No-clean residue eliminates the need for post-solder cleaning, saving time and cost. Low residue leaves minimal, non-conductive deposits that do not affect electrical performance. Suitable for a wide range of soldering tasks including SMD, THT, and manual soldering on copper, brass, and tin-plated surfaces.

Suitable for

• General soldering and electronics assembly
• Rework and repair of PCBs
• Manual soldering of through-hole and surface-mount components
• Copper, brass, and tin-plated surfaces

Key specifications

• Product type: Soldering flux paste
• Flux chemistry: Halogen-free (HF)
• Container: Tin can, 28 mm diameter
• Net weight: 20 g
• Residue type: Low residue, non-corrosive
• Cleaning required: No-clean
• Activity level: ROL0 (IPC J-STD-004)
• Viscosity: Paste
• Color: Light yellow/amber
• Recommended storage temperature: 5°C to 25°C
• Shelf life: 24 months (unopened)
• Standard: DIN EN 29454-1 1.1.2.B

Recommendations

Store in a cool, dry place between 5°C and 25°C. Use within 24 months of opening for best performance. Apply sparingly to solder joints; no cleaning is required after soldering.