Heatsink/Radiator HPE P49145-B21 HP Enterprise Width 167 mm

The HPE P49145-B21 HP Enterprise heatsink/radiator is a cooling component designed for use in compatible HP Enterprise systems. With a width of 167 mm and a compact weight of 0.64 kg, this heatsink supports processor thermal management by providing a conductive path for heat away from the CPU area. It is intended to help maintain stable operating temperatures and contribute to system reliability in server and workstation environments.

Advantages

This heatsink/radiator offers a balance of size and thermal conduction suitable for systems that accept a 167 mm wide cooling module. Its lightweight construction simplifies installation and reduces additional load on the motherboard or mounting assembly. As an HPE-branded component, it is designed to align with HP Enterprise mechanical and thermal specifications for compatible platforms.

Suitable for

• Cooling processors in HP Enterprise servers and workstations that accept a 167 mm width heatsink
• System builds requiring a compact, lightweight thermal solution
• Maintenance or replacement of existing compatible HPE cooling components

Key specifications

• Type: Heatsink/Radiator
• Width: 167 mm
• Weight: 0.64 kg
• Brand compatibility: HP Enterprise platforms (where supported)

How to use

Before installation, verify platform compatibility and ensure the system is powered off and unplugged. Remove any existing cooling solution according to the server or workstation service manual. Position the HPE P49145-B21 heatsink over the processor area using the appropriate mounting points and secure it following HP Enterprise mechanical instructions. Apply thermal interface material as required by the platform guidelines to ensure contact between the heatsink base and the processor heat spreader. After installation, reconnect power and monitor system temperatures to confirm correct operation.

Recommendations

Use this heatsink/radiator only in systems listed as compatible by HP Enterprise. Follow the host platform’s service documentation for torque specifications, thermal interface material type and amount, airflow orientation, and any firmware or BIOS settings related to thermal management.