Donau Elektronik LD10-4 Enamelled Copper Wire, 0.10 mm Outer Diameter, 100 m, Polyurethane Insulation, Solderable, 155°C, AWG 40

Winding coils, repairing transformers, or building custom inductors demands a magnet wire that combines precise dimensions, reliable insulation, and easy solderability. The Donau Elektronik LD10-4 enamelled copper wire delivers exactly that: a 100-metre spool of solid electrolytic copper with a polyurethane enamel coating, ready for your most demanding electronics projects.

Who is it for

This wire is ideal for hobbyists, repair technicians, and engineers working on motors, relays, solenoids, RF coils, and small transformers. Its fine 0.10 mm outer diameter (approximately AWG 40) suits miniature windings where space is tight and precision matters.

Main features

• High-purity electrolytic copper conductor for excellent conductivity
• Polyurethane enamel insulation, directly solderable without stripping
• Temperature class 155 °C (Class F) for reliable operation in hot environments
• Single-build insulation (Grade 1) with a minimum dielectric strength of 500 V
• Compliant with IEC 60317-20 / DIN EN 60317-20 standards
• Supplied on a convenient spool for tangle-free dispensing

Specifications

• Conductor material: Electrolytic copper
• Insulation material: Polyurethane enamel
• Outer diameter (including insulation): 0.10 mm
• Conductor diameter (bare wire): 0.08 mm
• Wire gauge: Approx. AWG 40
• Length: 100 m
• Conductor cross-sectional area: 0.0050 mm²
• DC resistance per meter: Approx. 3.34 Ω/m
• Temperature class: 155 °C (Class F)
• Insulation grade: Grade 1 (single build)
• Dielectric strength (minimum): 500 V
• Solderability: Direct solderable
• Number of strands: 1 (solid core)
• Insulation colour: Transparent / amber
• Packaging: Spool

Tips

When soldering, use a fine tip and moderate temperature (350–400 °C) to avoid damaging the enamel. For high-frequency applications, keep windings tight and uniform to minimise parasitic capacitance. Store the spool in a dry place to prevent oxidation of the copper surface.