DEHN Equipotential Bonding Bar 563020 - 5x2.5-25 mm², 3x16-95 mm², 100 kA

The DEHN 563020 equipotential bonding bar stands out with its dual-size terminal layout, accommodating both small conductors from 2.5 to 25 mm² and large conductors from 16 to 95 mm² in a single compact unit. This design simplifies main equipotential bonding installations where mixed conductor sizes must be connected to a common busbar.

Highlights

• 5 terminals for conductors 2.5–25 mm² (fine-stranded or solid)
• 3 terminals for conductors 16–95 mm² (fine-stranded or solid)
• Rated lightning impulse current (10/350 µs): 100 kA
• Rated impulse current (8/20 µs): 100 kA
• Transparent, hinged, sealable cover for inspection and protection
• Surface-mount design with polystyrene base plate

In daily use

Installers benefit from the clear terminal marking and the robust nickel-plated brass contact bar, which ensures reliable long-term conductivity. The transparent cover allows visual verification without opening, and the sealable hinge helps prevent unauthorized access. The bar is suitable for main equipotential bonding in electrical installations according to DIN EN 62561-1.

Full specifications

• Product type: Equipotential bonding bar
• Application: Main equipotential bonding
• Number of terminals (small conductors): 5
• Conductor size range (small conductors): 2.5 - 25 mm²
• Number of terminals (large conductors): 3
• Conductor size range (large conductors): 16 - 95 mm²
• Flat conductor connection: 1 x 30x3.5 mm
• Round conductor connection (additional): 1 x up to 10 mm
• Rated lightning impulse current (10/350 µs): 100 kA
• Rated impulse current (8/20 µs): 100 kA
• Base plate material: Polystyrene (PS)
• Contact bar material: Brass, nickel-plated
• Screw material: Steel, galvanized
• Cover type: Transparent, hinged, sealable
• Mounting type: Surface mount
• Protection class: IP20
• Standard compliance: DIN EN 62561-1 (VDE 0185-561-1)
• Operating temperature range: -25 °C to +40 °C

Final note

The DEHN 563020 provides a reliable and code-compliant solution for main equipotential bonding, combining high current withstand capability with practical installation features.