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LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box

LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
R106
For electronics work where residue and reliability matter, this lead-free solder wire from LogiLink stands apart with its silver-bearing alloy and no-clean flux core. The Sn99.3Cu0.7 composition delivers a melting point of 227 °C, making it suitable for both manual soldering and rework on temperatur... Read More
Stock Out Of Stock Code 3313519 Brand LOGILINK Model SA0012 Warranty 2 Years

Shipping & Returns

For electronics work where residue and reliability matter, this lead-free solder wire from LogiLink stands apart with its silver-bearing alloy and no-clean flux core. The Sn99.3Cu0.7 composition delivers a melting point of 227 °C, making it suitable for both manual soldering and rework on temperature-sensitive boards. Unlike standard tin-lead solders, it meets RoHS requirements without compromising joint strength or electrical performance. The 1 mm diameter offers a practical balance between fine control and sufficient solder volume for through-hole and larger SMD pads. Packaged in a 12.5 g mini dispenser box, it stays protected and tangle-free until needed.

Highlights

  • Lead-free alloy Sn99.3Cu0.7 (tin 99.3 %, copper 0.7 %) with silver-bearing designation
  • No-clean synthetic resin flux core, 2.5 % flux content, halide-free (<0.05 %)
  • Low spatter, low odor, transparent non-tacky residue after soldering
  • Melting point 227 °C for efficient heat transfer and reduced thermal stress
  • Compliant with RoHS and J-STD-004 classification REL0
  • Convenient 12.5 g dispenser box with 1.0 mm wire diameter

In daily use

The no-clean flux leaves a clear, non-corrosive residue that does not require removal in most applications, saving time during assembly and repair. The low spatter and low odor characteristics improve workplace comfort, while the high electrical reliability ensures stable connections over the product's lifetime. Whether you are soldering connectors, wires, or PCB components, this solder flows smoothly and wets quickly on copper and tin-plated surfaces. The dispenser box allows one-handed feeding of the wire, keeping the work area organized.

Full specifications

  • Alloy composition: Sn99.3Cu0.7 (tin 99.3 %, copper 0.7 %)
  • Wire diameter: 1.0 mm
  • Net weight: 12.5 g
  • Flux type: No-clean, synthetic resin
  • Flux content: 2.5 %
  • Melting point: 227 °C
  • Halide content: <0.05 % (halide-free)
  • Residue: Transparent, non-tacky, non-corrosive
  • Spatter level: Low
  • Odor: Low
  • J-STD-004 classification: REL0
  • RoHS compliant: Yes
  • Application: Manual soldering, rework, repair
  • Dispenser type: Mini dispenser box

Final note

LogiLink's SA0012 solder wire combines environmental compliance with professional soldering performance, making it a reliable choice for workshops, labs, and hobbyists who demand clean, strong joints without the hassle of aggressive flux residues.

Specifications
Brand
LogiLink
Category
Soldering Wire
Compliance certificates
RoHS
EAN
4052792054439
Harmonized System (HS) code
83113000
Model
SA0012
MPN
SA0012
Quantity per pack
1
Sustainability compliance
RoHS
Price history over the last 6 months
LogiLink Lead-Free Silver-Bearing Solder Wire Sn99.3Cu0.7, 1 mm, 12.5 g Dispenser Box
Current
R106
Lowest
R95
Highest
R106
Change 24H
+R10   +10%
Week
+R11   +11%
Month
—   

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